JESD-30 Code:
Mounting Style:
Package Shape:
Package Type:
Peak Reflow Temperature (Cel):
Seated Height-Max:
Series:
Supplier Device Package:
Supplier Package:
Surface Mount:
Terminal Form:
Terminal Pitch:
Terminal Position:
Time@Peak Reflow Temperature-Max (s):
Width:
Filter:
2 Records

Browse I/O Expanders components including ICs, modules, and related parts. Datasheets, alternatives, and global sourcing available.

Image Part Manufacturer Description Price Stock Action
MCP23S17T-E/ML Microchip Technology
-
RFQ
14,608
In-stock Warehouse
ADD TO RFQ
MCP23S17-E/SP Microchip Technology
-
RFQ
215
In-stock Warehouse
ADD TO RFQ
RFQ
BOM